Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP

PeakView®‘s automated xLEM™ flow extends Lorentz’s 3D EM leadership from design to full-chip EM sign-off, delivering complete, LVS-clean electromagnetic verification for today’s and next-generation ultra-high-speed AI, photonics and IC/3DIC designs SANTA CLARA, Calif. — Lorentz Solution, Inc., the world’s leading provider of 3D electromagnetic (EM) design platforms for IC, 3DIC, and advanced packaging, today announced […]